Rumor: No Liquid Metal in New PlayStation 5 Model

Gaming console companies these days are working day in and day out to make the gaming experience for fans better and superior. Be it advancement in the controllers or the upgradation of the whole console setup, companies are always pursuing the modernization process to be ahead of the curve. We will see something similar very soon with the PlayStation 5.

Speculation has risen regarding the two new upcoming models of the PlayStation 5: Pro and Slim. And there are rumors that Sony will be using some modern and efficient features in the rumored PS5 Slim, which have never been seen on any other past PlayStation consoles. So, what are the unique features? Let’s find out.

5nm APU in the Play Station 5 Slim

Despite initial chip scarcity due to the pandemic, PS5 still managed to garner sales of over 38.4 million units (as of May 23, 2023). And the upcoming features in the PS5 Slim will surely make sales skyrocket.

Right now, there are a total of five PS5 series: CFI-1000A/B, CFI-1016A/B, CFI-1116A/B, CFI-1202A/B, and CFI-1216A/. The PS5 Slim is going to be in the CFI-1300 series. This rumored series is going to have a 5nm APU, which is a significant upgrade from the current 6nm chipset. This improved chipset is going to enhance power efficiency and reduce the heating effect to assure a more cost-effective, cooler, and smoother gameplay experience.

There has already been a major hardware upgrade in the CFI-1202A/B series with the introduction of the AMD Oberon Plus APU (6 nm). There might have been an architectural upgrade in the PS5 Slim, but according to reliable insider Tom Henderson, there might not have been any major hardware upgrades, unlike the CFI-1202A and B series.

No Liquid Metal Colling System in PS5 Slim

Another striking aspect of the PS5 Slim is that there won’t be any liquid metal cooling system in the console. Liquid metal cooling has been an efficient feature for heat dissipation. But this system had its own flaws too. In some cases, when the console is overheated way too much, the liquid from the cooling system can spill out and spread all over the APU, destroying the chipset. Not only that, the omission of the liquid metal cooling system can save a lot of money for the company and also reduce complexities while manufacturing the consoles.

As the 5nm chipset will be a lot more power-efficient and less heat-producing, the exclusion of the liquid metal cooling process makes sense. Although to ensure a streamlined gameplay experience for the heavy hardware-demanding AAA titles of these days, Sony will surely find some advanced cooling technology in the PS5 Slim other than the liquid metal cooling system.

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This is a moment of excitement for all the fans out there because another powerful member will soon join Sony’s PlayStation family. And backed up by superb experiences from all the previous PlayStation consoles, fans are really counting on the PS5 Slim, to maintain the legacy intact.

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